Inspectable liquid-crystal display panel and method of inspecting same

ABSTRACT

A liquid-crystal display panel 20 comprises a first substrate 30 having an IC chip 60 mounted on the margin thereof and a second substrate 50 opposed to the first substrate 30 except the margin 31 on which the IC chip 60 is mounted. The first substrate 30 has two rows of pads 33 and 34, which are used to attach the IC chip 60, arranged nearly parallel to a side of the second substrate 50 adjoining the margin 31 on the margin 31 on which the IC chip 60 is mounted. A wiring pattern of lines passing through the pads on the row of pads 33 near the adjoining side of the second substrate 50 out of the rows of pads 33 and 34 includes a straight wiring-pattern part 38 extended straight to the inside of an IC chip mounting region 40 or a region in which the IC chip 60 is mounted. As such, a liquid-crystal display panel is provided which is capable of being tested for lighting prior to mounting of an IC chip even though a wiring pattern surrounding the IC chip on a liquid-crystal substrate is very short.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a liquid-crystal display panel and amethod of inspecting a liquid-crystal display panel. More particularly,this invention is concerned with a liquid-crystal display panel capableof being inspected for lighting prior to mounting of an IC chip withoutthe necessity of enlarging a portion of the liquid-crystal display paneloutside a display region, and a method of inspecting a liquid-crystaldisplay panel.

2. Discussion

In the field of equipment using liquid-crystal display panels, there isa demand for obtaining as large an area of display as possible byminimizing a region outside a display region of a liquid-crystal displaypanel, within the limited size of an equipment having the liquid-crystalpanel mounted thereon.

On the other hand, there is a demand for making a volume occupied by aliquid-crystal display panel and circuits for driving the liquid-crystaldisplay panel as small as possible so as to realize a thin andlightweight equipment in which the liquid-crystal display panel isemployed. A chip-on-glass (COG) substrate having an IC chip, whichincludes drive circuits or the like, mounted on the margin thereof iswidely applied for a substrate used to form a liquid-crystal displaypanel.

For applying the COG substrate having an IC chip, used for drivecircuits of the like, mounted on the margin thereof for a substrate forforming a liquid-crystal display panel, and for making the marginmounted with the IC chip, which is a non-display region, as small aspossible, a wiring pattern surrounding the IC chip is designed to have aminimum length.

However, as far as this kind of liquid-crystal display panel isconcerned, since the wiring pattern surrounding the IC chip is tooshort, when contact terminals of an inspection instrument used toinspect a liquid-crystal display panel for lighting prior to mounting ofan IC chip are brought into contact with lines constituting the writingpattern for the purpose of lighting inspection, sufficient electricalcontact cannot be attained. This causes a problem that the lightinginspection becomes hard to do.

The present invention attempts to solve the above problem. An object ofthe present invention is to provide a liquid-crystal display panelcapable of being inspected for lighting prior to mounting of an IC chipeven when a wiring pattern surrounding the IC chip on a liquid-crystalsubstrate is very short, and a method of inspecting a liquid-crystaldisplay panel.

SUMMARY OF THE INVENTION

According to the claim 1 of the present invention, the liquid-crystaldisplay panel comprises a first substrate having an IC chip mounted onthe margin thereof, and a second substrate opposed to the firstsubstrate except the margin on which the IC chip is mounted. Theliquid-crystal display panel is characterized in that: the firstsubstrate has two rows of pads, which are used to attach the IC chip,arranged nearly parallel to a side of the second substrate adjoining themargin on the margin on which the IC chip is mounted; and a wiringpattern of lines passing through the pads on the row of the adjoiningside of the second substrate includes a straight wiring-pattern partextending straight to the inside of an IC chip mounting region or aregion on which the IC chip is mounted.

According to the claim 1 of the present invention, the first substratethat is one of two substrates of the liquid-crystal display panel hasthe pads, which are used to attach the IC chip, formed on the marginthereof not opposed to the second substrate that is the other substrate.A straight wiring pattern of lines passing through the pads on the rowof pads parallel to the adjoining side of the second substrate and nearthe second substrate is extended straight to a position inside a regionto be occupied by the IC chip when the IC chip is mounted, and thus isformed as the straight wiring-pattern part. When the liquid-crystaldisplay panel is tested for lighting prior to mounting of the IC chip, acontact connector for inspection is brought into contact with thestraight wiring-pattern part. Thus, sufficient electrical contact can beattained, and a driving signal for driving the liquid-crystal displaypanel can be supplied through the contact connector for inspection. Eventhough the portion of the wiring pattern which connects the row of padsnear the second substrate and is not hidden behind the second substrate,is very short, the liquid-crystal display panel can be tested forlighting prior to mounting of the IC chip.

According to the claim 2 of the present invention, the liquid-crystaldisplay panel comprises a first substrate having an IC chip mounted onthe margin thereof, and a second substrate opposed to the firstsubstrate except the margin on which the IC chip is mounted. Theliquid-crystal display panel is characterized in that: the firstsubstrate has two rows of pads, which are used to attach the IC chip,arranged nearly parallel to a side of the second substrate adjoining themargin on the margin on which the IC chip is mounted; and each pad onthe row of the adjoining side of the second substrate is formed with astraight wiring-pattern part that is a longer straight wiring patternthan a straight wiring pattern provided as parts of the pads on the rowfar away from the adjoining side.

According to the claim 2 of the present invention, the first substratethat is one of two substrates of the liquid-crystal display panel hasthe pads, which are used to attach the IC chip, formed on the marginthereof not opposed to the second substrate that is the other substrate.The straight wiring pattern passing through the pads on the row of padsparallel to the adjoining side of the second substrate and near thesecond substrate is extended longer than the straight wiring patternpassing through the pads on the opposed row of pads, and is formed asthe straight wiring-pattern part. When the liquid-crystal display panelis tested for lighting prior to mounting of the IC chip, a contactconnector for inspection is brought into contact with the straightwiring-pattern part. Thus, sufficient electrical contact can beattained, and a driving signal for driving the liquid-crystal displaypanel can be supplied through the contact connector for inspection. Eventhough the portion of the wiring pattern connecting the row of pads nearthe second substrate, which is not hidden behind the second substrate,is very short, the liquid-crystal display panel can be tested forlighting prior to mounting of the IC chip.

According to the claim 3 of the present invention, the liquid-crystaldisplay panel comprises a first substrate having an IC chip mounted onthe margin thereof, and a second substrate opposed to the firstsubstrate except the margin on which the IC chip is mounted, and that isinspected for lighting prior to mounting of the IC chip. Theliquid-crystal display panel is characterized in that: the firstsubstrate has two rows of pads, which are used to attach the IC chip,arranged nearly parallel to a side of the second substrate adjoining themargin on the margin on which the IC chip is mounted; and a writingpattern passing through the pads on the row of the adjoining side of thesecond substrate includes a straight wiring-pattern part that extendsstraight to the inside of a region on which the IC chip is mounted andthat has a length corresponding to the length of contact terminals of acontact connector for inspection.

According to the claim 3 of the present invention, the first substratethat is one of two substrates of the liquid-crystal display panel hasthe pads, which are used to attach the IC chip, formed on the marginthereof not opposed to the second substrate that is the other substrate.The straight wiring pattern passing through the pads on the row of padsparallel to the adjoining side of the second substrate and near thesecond substrate is extended to the inside of the region on which the ICchip is mounted, and is formed as the straight wiring-pattern part. Thestraight wiring-pattern part has a length permitting sufficientelectrical contact by bringing into contact with the contact connectorfor inspection which is used to test the liquid-crystal panel displayfor lighting prior to mounting of the IC chip. A driving signal fordriving the liquid-crystal display panel can be supplied through thecontact connector for inspection. Even though the portion of the wiringpattern connecting the row of pads near the second substrate, which isnot hidden behind the second substrate, is very short, theliquid-crystal display panel can be tested for lighting prior tomounting of the IC chip.

According to the claim 4 of the present invention, a liquid-crystaldisplay panel in accordance with any of the claim 1 to 3 ischaracterized that the IC chip and first substrate are adhered to eachother using an insulating adhesive outside the area of the pads withinthe region on which the IC chip is mounted.

According to the claim 4 of the present invention, the IC chip and firstsubstrate are adhered to each other using the insulating adhesive exceptthe area of the pads. The IC chip can therefore be fixed to thesubstrate reliably. And also, the straight wiring-pattern part extendedto a position opposed to the bottom of the IC chip and the bottom of theIC chip can be reliably isolated from each other.

According to the claim 5 of the present invention, the method ofinspecting a liquid-crystal display panel is a method of inspecting aliquid-crystal display panel in accordance with any of the claim 1 to 4.The method of inspecting a liquid-crystal display panel is characterizedby having a step of bringing the contact terminals corresponding to thecontact connector for inspection into contact with a plurality of thestraight wiring-pattern parts.

According to the claim 5 of the present invention, the contact connectorfor inspection is brought into contact with the straight wiring-patternpart having a length permitting sufficient electrical contact with thecontact connector for inspection for the purpose of inspecting theliquid-crystal display panel. The liquid-crystal display panel cantherefore be inspected highly reliably.

BRIEF DESCRIPTION OF THE DRAWINGS

In order to appreciate the manner in which the advantages and objects ofthe invention are obtained, a more particular description of theinvention will be rendered by reference to specific embodiments thereofwhich are illustrated in the appended drawings. Understanding that thesedrawings only depict preferred embodiments of the present invention andare not therefore to be considered limiting in scope, the invention willbe described and explained with additional specificity and detailthrough the use of the accompanying drawings in which:

FIG. 1 is a typical plan view showing a liquid-crystal display panel ofan embodiment having no IC chip mounted thereon;

FIG. 2 is a typical oblique view showing the liquid-crystal displaypanel of the embodiment;

FIG. 3 is a typical sectional view showing an IC chip and itssurroundings on the liquid-crystal display panel of the embodiment;

FIG. 4 is an oblique view showing the positional relationship among aliquid-crystal panel holding plate of an inspection instrument, aliquid-crystal display panel, and a contact connector for inspection;

FIG. 5 is a typical oblique view showing the contact connector forinspection;

FIG. 6 is a typical bottom view showing the contact connector forinspection;

FIG. 7 is another typical oblique view showing the contact connector forinspection;

FIG. 8 is another typical bottom view showing the contact connector forinspection;

FIG. 9 is a typical oblique view showing a main inspection-instrumentunit; and

FIG. 10 is a typical sectional view showing an inspector of aninspection instrument along the E--E line shown in FIG. 7.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Referring to the drawings, a preferred embodiment of the presentinvention will be explained in more detail.

FIG. 1 is a typical plan view showing a liquid-crystal display panel 20of an embodiment having no IC chip mounted thereon. The liquid-crystaldisplay panel 20 of this embodiment is a super-twisted nematic (STN)simple matrix liquid-crystal display panel 20 comprising a firstsubstrate 30 that has an IC chip 60 (see FIG. 2) mountable on a margin31 thereof, and a second substrate 50 that is smaller than the firstsubstrate 30 by the size of the margin 31 on which the IC chip ismounted. The second substrate 50 is opposed to the first substrate 30except the margin of the first substrate 31 on which the IC chip 60 ismounted.

The first substrate 30 is provided with pads 32, for connecting to bumps62 (see FIG. 3) of the IC chip on the margin 31 not opposed to thesecond substrate 50, and wiring patterns 36 and 42 of lines extendingfrom the pads 32. The pads 32 are arranged in rows along the margin 31of the IC chip 60. Among the pads, two rows of pads 33 and 34 are nearlyparallel to a side of the second substrate 50 adjoining the margin. Thewiring pattern passing through the pads 32 of the row 33 near theadjoining side of the second substrate 50 out of the two rows 33 and 34is, as shown in FIG. 1, extending straight to the inside of an IC chipmounting region 40 that is a region to be occupied by the IC chip 60when the IC chip is mounted on the substrate, and is thus formed as astraight wiring-pattern part 38 reaching a position beyond a center lineof the IC chip mounting region 40. The straight wiring-pattern part 38extends straight to the inside of the IC chip mounting region 40 and hasnearly the same length as the length of contact terminals 84 in a centerarea 85 corresponding to the straight wiring pattern 38 of a contactconnector for inspection 80, which will be described later in theoblique view of FIG. 5 and the bottom view of FIG. 6. The straightwiring-pattern part 38 is a longer straight wiring pattern than astraight wiring pattern extending from the pads 32 of the opposed row34.

Since the straight wiring-pattern part 38 has a sufficient length, whenthe liquid-crystal display panel 20 is tested for lighting prior tomounting of the IC chip 60, sufficient electrical contact can beattained in the contact terminals 84 in the center area 85 provided inthe contact connector for inspection 80 attached to the straightwiring-pattern part 38. Consequently, even though the portion of thewiring pattern between a display region 22 of the liquid-crystal displaypanel 20 and the row of pads 33 near the second substrate 30, which isnot hidden behind the second substrate 50, is very short, as shown inthis embodiment, a driving signal can be supplied to the liquid-crystaldisplay panel 20 through the contact terminals 84 in the center area 85provided in the contact connector for inspection 80. Thus, theliquid-crystal display panel 20 can be tested for lighting prior tomounting of the IC chip 60.

The liquid-crystal display panel 20 of this embodiment is inspected forlighting using the contact connector for inspection 80 that is attachedto the straight wiring-pattern part 38 in order to attain electricalcontact. Thereafter, as shown in the typical oblique view of FIG. 2, theIC chip 60 is mounted in the IC chip mounting region 40 on the margin 31of the first substrate 30. Thus, a finished product is provided.

Prior to mounting of the IC chip 60, as shown in the typical sectionalview of FIG. 3, an anisotropic conductive-material layer 66 is formed onthe first substrate 30 in an area consisting of the rows of pads 33, 34,and 35 used to attach the IC chip 60. An insulating adhesive layer 68 isformed in an area other than the area of the rows of pads 33, 34, and 35within the IC chip mounting region 40. The bumps 62 of the IC chip 60are therefore electrically connected to the pads 32 on the firstsubstrate 30 via the anisotropic conductive-material layer 66. In FIG.3, a polarizing plate, reflector, and the like are not shown. The ICchip mounting region 40 containing the straight wiring-pattern part 38on the first substrate 30 is adhered to the bottom of the IC chip 60 viathe insulating adhesive layer 68 except the area of the rows of pads 33,34, and 35.

The IC chip 60 can therefore be reliably fixed to the first substrate30. Moreover, the straight wiring-pattern part 38 extended to a positionopposed to the bottom of the IC chip 30 and the bottom of the IC chip 60can be isolated from each other reliably.

Now, a method of inspecting the liquid-crystal display panel 20 forlighting prior to mounting of the IC chip will be described.

First, as shown in the oblique view of FIG. 4, the liquid-crystaldisplay panel 20 is fitted into a concave part 96 of a liquid-crystalpanel holding plate 94 that is part of an inspection instrument and madeof an acrylic. According to this embodiment, for carrying out lightinginspection, the contact terminals 84 located on one surface of thecontact connector for inspection 80 shown in FIG. 4 are attached to thepositioned liquid-crystal display panel 20 to be brought into contactwith the straight wiring-pattern part 38 of the liquid-crystal displaypanel 20, and thus driven to conduction relative to a printed-circuitboard 86, connected to the contact connector for inspection 80, whichwill be described later. The inspection is then carried out.

The contact connector for inspection 80 has, as shown in the obliqueview of FIG. 5, insulating elastic members 82 made of a rubber, silicon,or the like, and metallic members 81 made of copper, aluminum, or thelike, which are arranged alternately in zebra shape (lines and referencenumerals are omitted from the dotted portions of FIG. 5). FIG. 6 is abottom view of the contact connector for inspection 80. The contactconnector for inspection 80 has the metallic members 81 and elasticmembers 82 located alternately even on the bottom thereof (lines andreference numerals are omitted from the dotted portions of FIG. 6). Themetallic members 81 located on the bottom of the contact connector forinspection 80 act as the contact terminals 84, and are, if necessary,gold-plated.

As shown in FIG. 4, the liquid-crystal display panel 20 positioned onthe liquid-crystal panel holding plate 94 is locked in a maininspection-instrument unit 72 shown in FIG. 9 together with theliquid-crystal panel holding plate, and then inspected. Specifically,openings 94 formed at four corners of the liquid-crystal panel holdingplate 94 having the concave part 96 into which the liquid-crystaldisplay panel 20 is fitted are engaged with four convex parts 74 of themain inspection-instrument unit 72. Thus, the liquid-crystal holdingplate 94 is fixed on the main inspection-instrument unit 72.

The main inspection-instrument unit 72 shown in FIG. 9 has an inspector78 which fits the arms 76 that are movable towards the lockedliquid-crystal display panel 20 with the contact connector forinspection 80. FIG. 10 is a sectional view of the inspector 78 on theE--E line shown in FIG. 9. As shown in the drawing, the inspector 78 hasa reinforcement member 88 and presser member 90 located on the front andthe rear of the contact connector for inspection 80. With the contactconnector for inspection 80 between to lock the reinforcement member 88and presser member 90. One end of the contact connector for inspection80 is jutting downward so as to come into contact with the straightwiring-pattern part 38 of the liquid-crystal display panel 20 as shownin FIG. 4. The other end of the contact connector for inspection 80 isin contact with a terminal portion (not shown) of the printed-circuitboard 86 located on a deep part in the inspector 78. The terminals ofthe printed-circuit board 87 and the corresponding metallic members 81of the contact connector for inspection 80 are thus electricallyconnected with each other.

The arms 76 of the main inspection-instrument unit 72 are pressed down,whereby the contact connector for inspection 80 of the inspector 78 isattached to the margin 31 of the first substrate 30 of theliquid-crystal display panel 20 with a slight pressing force. Thestraight wiring-pattern parts 38 are then brought into contact with thecorresponding contact terminals 84 in the center area 85 of the contactconnector for inspection 80. Consequently, the printed-circuit board 86and liquid-crystal display panel 20 are electrically connected to eachother via the contact connector for inspection 80. The liquid-crystaldisplay panel 20 is then fully lit. Lighting inspection is achieved bychecking visually or through image recognition whether or not theliquid-crystal display panel 20 is fully lit in this state.

In the inspector 78 of the inspection instrument, as shown in FIGS. 5and 6, areas 86 for bringing into contact with the wiring patterns 42linking the pads on the other rows of pads 35, which are used to attachthe IC chip 60, and the display region 22 of the liquid-crystal displaypanel 20 are formed on the contact connector for inspection, and have,like the center area 85, contact terminals 84. When the arms 76 of themain inspection-instrument unit 72 are lowered, the contact terminals 84in the both sides areas 86 of the contact connector for inspection 80are brought into contact with the given wiring patterns 42 on theliquid-crystal display panel 20 in the same state as the aforesaid stateat the same time when the contact terminals 84 in the center area 85 arebrought into contact with the associated lines. The wiring patterns 42can be designed to have straight parts that are long enough to bring theexposed lines of the wiring patterns 42 into contact with the contactterminals 84 in the both sides areas 86 of the contact connector forinspection 80. It is not especially necessary to extend the wiringpatterns 42 to the inside of the IC chip mounting region. Moreover, whenthe same signal is supplied to the wiring patterns 42 connected to therows of pads 35 for the IC chip 60 in order to carry out lightinginspection, the contact terminals 84 in the both sides areas 86 of thecontact connector 80 for inspection which are brought into contactcorresponding to the exposed lines of the wiring patterns 42 may beprovided not in zebra shape but in plane (lines and reference numeralsare omitted from the dotted portions of the drawings). Moreover,according to this embodiment, the inspection instrument for lightinginspection is designed so that the contact connector for inspection 80has both the contact terminals 84 in the center area 85 and the contactterminals 84 in the both sides areas 86. Alternatively, independentinspection connectors may be provided for attaching to theliquid-crystal display panel concurrently or separately by lowering thearms 76 of the main inspection-instrument unit 72.

As mentioned above, the liquid-crystal display panel 20 of thisembodiment is inspected for lighting prior to mounting of the IC chip60.

According to the method of inspecting the liquid-crystal display panel20 of this embodiment, the contact connector for inspection 80 isbrought into contact with the straight wiring-pattern part 38 having alength permitting sufficient electrical contact with the contactconnector for inspection 80 to inspect the liquid-crystal display panel20 prior to mounting of the IC chip 60. Consequently, the liquid-crystaldisplay panel 20 can be inspected highly reliably.

Moreover, the liquid-crystal display panel 20 is fitted into the concavepart 96 of the liquid-crystal panel holding plate 94, and theliquid-crystal panel holding plate 94 is locked at a given position inthe main inspection-instrument unit 72. In this state, the contactconnector for inspection 80 incorporated in the inspector 7 attached tothe arms 76 of the main inspection-instrument unit 72 is attached to theliquid-crystal display panel 20. Consequently, the contact terminals 84located in the center area 85 of the contact connector for inspection 80can be brought into contact with the corresponding straightwiring-pattern part 38 of the liquid-crystal display panel 20 reliablyand readily with an accurate positional relationship maintained.Eventually, the liquid-crystal display panel 20 can be inspected forlighting prior to mounting of the IC chip 60 highly reliably andefficiently.

The embodiment of the present invention has been described so far.However, the present invention is not limited to the aforesaidembodiment. Various modifications can be constructed within the gist ofthe present invention or within the uniform combination of the claims.

For example, in the aforesaid embodiment, an IC chip to be mounted onthe first substrate is placed along only one side of the liquid-crystaldisplay panel. The present invention is not limited to this mode.Alternatively, the liquid-crystal display panel may be a liquid-crystaldisplay panel having a first substrate provided with the margin notopposed to a second substrate along a plurality of sides of the secondsubstrate, and can be applied for the case that IC chips are mounted onthe margin along the sides of the second substrate. In this case, thesame number of contact connectors for inspection as the number of ICchips are needed, and the inspector of the inspection instrument must bedesigned to correspond to the number of IC chips.

Moreover, in the aforesaid embodiment, the wiring pattern passingthrough the pads 32 of the row 33 near the second substrate 50 isextended straight to the inside of the IC chip mounting region 40 as thestraight wiring-pattern part. However, the present invention is notlimited to this mode. The pads of the row 33 near the second substrate50 may be formed in cross-stitched shape. In this case, a wiring patternpassing through pads on at least one of rows of pads 32 disposed incross-stitched shape should be extended straight to the inside of the ICchip mounting region 40 as the straight wiring-pattern part.

Furthermore, in the embodiment, the liquid-crystal display panel is aSTN simple matrix liquid-crystal display panel. Alternatively, an activematrix liquid-crystal display panel using three-terminal switchingelements, represented by the thin-film transistor (TFT) technology, ortwo-terminal switching elements, represented by themetal-insulator-metal (MIM) technology, can be applied. Furthermore, asfar as electro-optical characteristics are concerned, various types ofliquid-crystal display panels; that is, the STN type, twisted nematic(TN) type, guest-host type, polymer dispersed type, phase transitiontype, or ferroelectric type can be applied.

What is claimed is:
 1. A liquid-crystal display panel that comprises afirst substrate having an IC chip mounted on a margin thereof, and asecond substrate opposed to said first substrate except said margin onwhich said IC chip is mounted, characterized in that:said firstsubstrate has two rows of pads on said margin on which said IC ismounted, said pads being used to attach said IC chip and being arrangednearly parallel to a side of said second substrate adjoining saidmargin; and a wiring pattern of lines passing through each pad on therow nearest said adjoining side includes a straight wiring-pattern partterminating at the inside of an IC chip mounting region or a region inwhich said IC chip is mounted.
 2. A liquid-crystal display panelaccording to claim 1 wherein said IC chip and first substrate areadhered to each other using an insulating adhesive outside the area ofsaid pads within said IC chip mounting region.
 3. A method of inspectinga liquid-crystal display panel according to claim 1, characterized inthat:said method includes a step of bringing contact terminals of acontact connector for inspection into contact with a plurality of linesconstituting said straight wiring-pattern part.
 4. A liquid-crystaldisplay panel that comprises a first substrate having an IC chip mountedon a margin thereof, and a second substrate opposed to said firstsubstrate except said margin on which said IC chip is mounted,characterized in that:said first substrate has two rows of pads on saidmargin on which said IC chip is mounted, said pads being used to attachsaid IC chip and being arranged nearly parallel to a side of said secondsubstrate adjoining said margin; and the pads on the row nearest saidadjoining side are provided with a first straight wiring-pattern partextending from said second substrate, the pads on the row far away fromthe adjoining side are provided with a second straight wiring patternextending between said pads on the row far away from the adjoining sideand an edge of said first substrate, said first straight wiring patternbeing longer than said second straight wiring pattern.
 5. Aliquid-crystal display panel according to claim 4, wherein said IC chipand first substrate are adhered to each other using an insulatingadhesive outside the area of said pads within said IC chip mountingregion.
 6. A method of inspecting a liquid-crystal display panelaccording to claim 4, characterized in that:said method includes a stepof bringing contact terminals of contact connector for inspection intocontact with a plurality of lines constituting said first straightwiring-pattern part.
 7. A liquid-crystal display panel that comprises afirst substrate having an IC chip mounted on a margin thereof, and asecond substrate opposed to said first substrate except said margin onwhich said IC chip is mounted, and that is inspected for lighting priorto mounting of said IC chip, characterized in that:said first substratehas two rows of pads on said margin on which said IC chip is mounted,said pads being used to attach said IC chip and being arranged nearlyparallel to a side of said second substrate adjoining said margin; and awiring pattern of lines passing through the pads on the row nearest theadjoining side includes a straight wiring-pattern part extendingstraight to the inside of an IC chip mounting region and having a lengthcorresponding to a length of contact terminals formed on a contactconnector for inspection.
 8. A liquid-crystal display panel according toclaim 7, wherein said IC chip and first substrate are adhered to eachother using an insulating adhesive outside the area of said pads withinsaid IC chip mounting region.
 9. A method of inspecting a liquid-crystaldisplay panel according to claim 7, characterized in that:said methodincludes a step of bringing contact terminals of the contact connectorfor inspection into contact with a plurality of lines constituting saidstraight wiring-pattern part.
 10. A liquid crystal display panelarranged for testing prior to attachment of an IC chip, said liquidcrystal display panel comprising:a first substrate; a second substratedisposed on said first substrate so as to define a margin on said firstsubstrate for mounting said IC chip; a first row of pads for couplingwith said IC chip disposed on said margin adjacent and parallel to anedge of said second substrate adjacent said margin; a second row of padsfor coupling with said IC chip disposed on said margin laterally spacedapart from said first row of pads and parallel thereto; and a wiringpattern passing through said first row of pads, said wiring patternincluding a straight wiring pattern part for coupling with an inspectioncontact connector, said straight wiring pattern part terminating at anIC chip mounting region of said margin.
 11. A liquid crystal displaypanel arranged for testing prior to attachment of an IC chip, saidliquid crystal display panel comprising:a first substrate; a secondsubstrate disposed on said first substrate so as to define a margin onsaid first substrate for mounting said IC chip; a first row of pads forcoupling with said IC chip disposed on said margin adjacent and parallelto an edge of said second substrate adjacent said margin; a second rowof pads for coupling with said IC chip disposed on said margin laterallyspaced apart from said first row of pads and parallel thereto; a firststraight wiring-pattern part extending from said second substrate andpassing through said first row of pads for coupling with an inspectioncontact connector; and a second straight wiring-pattern part extendingbetween said second row of pads and an edge of said first substrate,said first straight wiring-pattern part being longer than said secondstraight wiring-pattern part.
 12. A liquid crystal display panelarranged for testing prior to attachment of an IC chip, said liquidcrystal display panel comprising:a first substrate; a second substratedisposed on said first substrate so as to define a margin on said firstsubstrate for mounting said IC chip; a first row of pads for couplingwith said IC chip disposed on said margin adjacent and parallel to anedge of said second substrate adjacent said margin; a second row of padsfor coupling with said IC chip disposed on said margin laterally spacedapart from said first row of pads and parallel thereto; and a wiringpattern passing through said first row of pads, said wiring patternincluding a straight wiring pattern part for coupling with an inspectioncontact connector extending to the center of an IC chip mounting regionof said margin and having a length corresponding to a length of contactterminals formed on said inspection contact connector.